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4 Layer RO4003C Circuit Boards
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Type:High Frequency Pcb

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PRODUCT DESCRIPTION

RO4003C

 Board Thickness

 1.0 mm

 Base Material

 Rogers4003C + FR4

 Copper Thickness

 1OZ

 Min. Line Width/ Spacing

 6mil (0.15mm)/6mil (0.15mm)

 Soldermask

 None

 Silkscreen Color

 None 

 Surface Finishing

 ENIG

 Min.Quantity of Order

 No MOQ

 Layer Count

 4 Layer

 Difficulty

 Rogers + FR4


RO4003C™ Laminates

Rogers RO4003C materials are proprietary woven glass reinforced hydrocarbon/ceramics with the electrical performance of PTFE/woven glass and the manufacturability of epoxy/ glass.

Features

  • Dk of 3.38 +/- 0.05

  • Dissipation factor of 0.0027 at 10 GHz

  • Low Z-axis coefficient of thermal expansion at 46 ppm/°C

Benefits

  • Ideal for multi-layer board (MLB) constructions

  • Processes like FR-4 at lower fabrication cost

  • Designed for performance sensitive, high volume applications

  • Competitively priced


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KingCredie follow the international standard manufacturing

  • ● IPC-4101 Specification for base materials rigid / multi-layer

  • ● IPC-600G Acceptability of Printed Boards / Class 2

  • ● IPC-6011 Generic Performance Specification for Printed Wiring Boards

  • ● IPC-6012B -Qualification and Performance Specification for Rigid Boards/class 2

  • ● IPC6013A- Qualification and Performance Specification for Flexible Printed Boards/class 2

  • ● IPC6016- Qualification and Performance Specification for High Density Interconnect(HDI) Layers or Boards/ class 2

  • ● IPC-SM-840 Qualification and Performance of permanent polymer coatings

  • ● MIL-PFR-55110 Military Performance and Specifications-Tucson

  • ● IPC-6018 Microwave End Product Board Inspection and Test-Tucson

  • ● IPC-TM-650 Test methods manual.



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