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ITEM | DESCRIPTION | CAPABIBITY |
Material | FR4, FR4 HIGH-TG | TG135, TG170, TG180, Halogen Free |
CTI | CTI175, CTI300, CTI600 | |
High Frequency Material | Rogers, Taconic, Arlon, Nelco, F4BK (Ro4350, Ro4003, 25FR, 25N...) | |
Metal Substrate Board | Aluminum Substrate, Copper Substrate |
HDI | High Density Interconnect | 1+N+1, 1+1+N+1+1, 2+N+2, 3+N+3 |
Microvia Hole Size | 0.1mm, 0.13mm, 0.15mm |
Surface Treatment | Lead | HASL |
Lead Free | ENIG, ENEPIG, Immersion Sliver, Immersion Tin, Flash Gold, Golden Finger, OSP, Lead Free HASL ect. |
Plating Thickness | HASL | 2-40um |
OSP | 0.2-0.6um | |
ENIG | Au: 0.025-0.1um Ni: 3-8um | |
Immersion Silver | 0.2-0.4um | |
Immersion Tin | ≥1um | |
Flash Gold | Au:0.025-0.1um Ni:3-8um | |
ENEPIG | Au:0.025-0.1um Ni:3-8um PB:0.025-0.15um | |
Golden Finger | Au:0.025-1.5um Ni:3-8um |
Other Thickness | Carbon | 10-50um |
Peelable | 0.2-0.4mm |
Drilling | Min Laser Drilling | 0.10mm |
Max Laser Drilling | 0.15mm | |
Mechanical Drilling | 0.15mm-6.50mm | |
Aspect Ratio | 1:0.8(Laser), 12:1(Mechanical) | |
Min distance via to Cu | 0.15(≤4Layers), 0.17mm(≤8Layers) | |
0.22mm(10-14Layers), 0.25mm(>14Layers) | ||
Min distance Drill to Drill | 0.15mm | |
Hole diameter tolerance | PTH: +/-0.075 (＜6.0MM), +/-0.15 (≥6.0MM) | |
NPTH: +/-0.05 (＜6.0MM), +/-0.10 (≥6.0MM) | ||
Press fit holes tolerance | +/-0.05mm | |
Counterbore/Countersink Diameter TOL | +/-0.15mm | |
Counterbore/Countersink depth TOL | +/-0.15mm | |
Blind slots (Z-milling) | +/-0.15mm | |
Backdrilling | +/-0.10mm |
VERIFIED BY
SOCIAL MEDIA
