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Rigid Pcb

Rigid Pcb Capabilities

Rigid PCB Capabilities

ITEM
DESCRIPTION
CAPABIBITY
Material
FR4, FR4 HIGH-TG
TG135, TG170, TG180, Halogen  Free
CTI
CTI175, CTI300, CTI600
High Frequency Material
Rogers, Taconic, Arlon, Nelco, F4BK (Ro4350, Ro4003, 25FR, 25N...)
Metal Substrate Board
Aluminum Substrate, Copper Substrate


HDI
High Density Interconnect
1+N+1, 1+1+N+1+1, 2+N+2, 3+N+3
Microvia Hole Size
0.1mm, 0.13mm, 0.15mm


Surface Treatment
Lead
HASL
Lead Free
ENIG, ENEPIG, Immersion Sliver, Immersion Tin, Flash Gold, Golden Finger, OSP, Lead Free HASL ect.


Plating Thickness
HASL
2-40um
OSP
0.2-0.6um
ENIG
Au: 0.025-0.1um Ni: 3-8um
Immersion Silver
0.2-0.4um
Immersion Tin
≥1um
Flash Gold
Au:0.025-0.1um Ni:3-8um
ENEPIG
Au:0.025-0.1um Ni:3-8um PB:0.025-0.15um
Golden Finger
Au:0.025-1.5um Ni:3-8um


Other Thickness
Carbon
10-50um
Peelable
0.2-0.4mm


Drilling
Min Laser Drilling
0.10mm
Max Laser Drilling
0.15mm
Mechanical Drilling
0.15mm-6.50mm
Aspect Ratio
1:0.8(Laser), 12:1(Mechanical)
Min distance via to Cu
0.15(≤4Layers), 0.17mm(≤8Layers)
0.22mm(10-14Layers), 0.25mm(>14Layers)
Min distance Drill to Drill
0.15mm
Hole diameter tolerance
PTH: +/-0.075 (<6.0MM), +/-0.15 (≥6.0MM)
NPTH: +/-0.05 (<6.0MM), +/-0.10 (≥6.0MM)
Press fit holes tolerance
+/-0.05mm
Counterbore/Countersink Diameter TOL
+/-0.15mm
Counterbore/Countersink depth TOL
+/-0.15mm
Blind slots (Z-milling)
+/-0.15mm
Backdrilling
+/-0.10mm


Min Land Size
Min Pad for via
 0.25mm(Laser Drill),0.4mm(Mechanical Drilling)
Min BGA Size
 0.18mm(Flash Gold), 0.3mm(Lead Free   HASL), 0.25mm(Other)
BGA Size Tolerance
 +/-15% or +/-1.5mil(BGA≤10mil)


Outer Layer
 Base Copper Samples Mass Productions
 1/3OZ 3/3mil (Track/Gap)
 3.5/4mil (Track/Gap)
 1/2OZ 3.9/4mil  4/5mil
 1OZ 5/6mil   5.5/7mil
 2OZ 6/8mil 6/9mil
 3OZ 6/11mil  7/12mil
 4OZ 7.5/15mil  8/16mil
 5OZ 9/18mil  N/A
 6OZ 10/21mil  N/A
 Trace Width Tolerance:  +/-20% +/-20%


Inter Layer
 Base Copper Samples Mass Productions
 1/2OZ 3/3mil (Track/Gap)   3/4mil (Track/Gap)
 1OZ 3.5/4mil  4/5mil
 2OZ 5/6mil  5/8mil
 3OZ 6/8.5mil  6/10mil
 4OZ 6/12mil  7/12mil
 5OZ 8/15mil N/A
 6OZ 10/17mil  N/A
 Trace Width Tolerance:  +/-20% +/-20%


Legend
Colors 
White, Black, Yellow
Min. Legend Height 
0.6mm


Solder Mask
Colors 
Green, Yellow ,Black, White, Blue, Red, Matte   green
Min Dam Width 
0.1mm(green color) , 0.15mm(other colors)
Thickness 
10-18um(Corner≥5um)


Profile
CNC Routing Tolerance Min.
+/-0.10mm
Copper to Outline Center
0.2mm
V-scoring Angles
20, 30, 45, 60 Deg
V-scoring Depth
1/3 of Board Thickness
Copper to V-scoring Center
0.4mm
Beveling Angles
30, 45 Deg (+/-5 Deg)
Beveling Depth
+/-0.10mm



Metal Substrate Board
Board Type
Aluminum substrate, Copper substrate, Embed Copper Core PCB, Direct Thermal Path PCB
Layer Count
Metal substrate: 1-12L, Ceramic substrate:   1-2L
Finished Size
610*610mm(Max)  5*5mm(Min)
Board Thickness
0.5-5.0mm
Max Copper Thickness
0.5-10 OZ
Thermal Conductivity
Standard materials: 1-3W/m.k,
Specified materials : 4-12W/m.k
Ceramic materials: 24-170W/m.k


Other
Max Copper Thickness
8OZ(Outer) 7OZ(Inter)
Layer Count 
1-24L
Board Thickness 
0.4mm~5.0mm
Board Thickness TOL 
±10%(>1.0mm); ±0.1mm(≤1.0mm)
Min Board Dimensions 
10*10mm
Impedance Tolerance
±5Ω(<50Ω), ±10%(≥50Ω)
Max Board Dimensions
20*30inch(2Layer)
22.5*30inch(4Layer) 
16.5*22.5inch(≥6Layer)
Twisting and Bending 
≤0.75%  Min0.5%



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