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Rigid Pcb

Rigid PCB Capabilities

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Item

Description

Capability

Material

FR4, FR4 HIGH-TG

TG135, TG170, TG180, Halogen Free

CTI

CTI175, CTI300, CTI600

High Frequency MaterialRo4350, Ro4003, 25FR, 25N
Rogers, Taconic, Arlon, Nelco, F4BK

Metal substrate board

Aluminum substrate, Copper substrate

HDI

High Density Interconnect

1+N+1、1+1+N+1+1、2+N+2、3+N+3

Min microvia hole size

0.1mm

Surface Treatment

Lead

HASL

Lead Free

ENIG, ENEPIG, Immersion Silver, Immersion Tin, Flash Gold, Golden Finger, OSP, Lead free HASL etc.

Plating Thickness 

HASL

2-40um

OSP

0.2-0.6um

ENIG

Au: 0.025-0.1um Ni: 3-8um

Immersion Silver

0.2-0.4um

Immersion Tin

≥1um

Flash Gold

Au:0.025-0.1um Ni:3-8um

ENEPIG

Au:0.025-0.1um Ni:3-8um Pd:0.025-0.15um

Golden Finger

Au:0.25-1.5um Ni:3-8um

Other Thickness 

Carbon

10-50um

Peelable mask

0.2-0.4mm

Drilling

Min Laser Drilling

0.1mm

Max Laser Drilling

0.15mm

Mechanical Drilling

0.15-6.5mm

Aspect Ratio

1:0.8(Laser)   12:1(Mechanical)

Min distance Via to CU

0.15mm(≤4Layer), 0.17mm(≤8Layer), 0.22mm(10-14Laye)

0.25mm(>14Layer)

Min distance Drill to Drill

0.15mm

Press fit Holes Tolerance

+/-0.05mm

Counterbore/Countersink Diameter TOL

+/-0.15mm

Counterbore/Countersink Depth TOL

+/-0.15mm

Blind slots (Z-milling)

Yes, +/-0.15mm

Backdrilling

Yes, +/-0.10mm

Min Land Size

Min Pad for via

0.25mm(Laser Drill)  0.4mm(Mechanical drilling)

Min BGA Size

0.18mm(Flash Gold)  0.3mm(Lead Free HASL)  0.25mm(Other)

BGA Size Tolerance

+/-15% or +/-1.5mil(BGA≤10mil)

Outer layer


Samples

Mass Productions

Base Copper 1/3OZ

3/3mil

3.5/4mil

Base Copper 1/2OZ

3.9/4mil

4/5mil

Base Copper 1OZ

5/6mil 

5.5/7mil

Base Copper 2OZ

6/8mil

6/9mil

Base Copper 3OZ

6/11mil

7/12mil

Base Copper 4OZ

7.5/15mil

8/16mil

Base Copper 5OZ

9/18mil

N/A

Base Copper 6OZ

10/21mil

N/A

Trace Width Tolerance

+/-20%

Inner layer

1/2OZ

3/3mil 

3/4mil

1OZ

3.5/4mil

4/5mil

2OZ

5/6mil

5/8mil

3OZ

6/8.5mil

6/10mil

4OZ

6/12mil

7/12mil

5OZ

8/15mil

N/A

6OZ

10/17mil

N/A

Trace Width Tolerance

+/-20%

Solder Mask

Colors

Green, Yellow ,Black, White, Blue, Red, Matte green

Min dam width

0.1mm(green color) , 0.15mm(other colors)

Thickness

10-18um(Corner≥5um)

Legend

Colors

White, Black, Yellow

Min. Legend Height

0.6mm

Profile

CNC Routing Tolerance Min.

+/-0.1mm

Copper to outline center

0.2mm

V-scoring Angles

20 30 45 60 Deg

V-score Depth

1/3 of board thickness

Copper to V-cut Center

0.4mm

Beveling Angles

30,  45 Deg  (+/-5 Deg)

Beveling Depth

+/-0.1mm

Metal substrate board

Layer count

Metal substrate: 1-12L, Ceramic substrate: 1-2L

Finished Size

610*610mm(Max)  5*5mm(Min)

Board Thickness

0.5-5.0mm

Max copper thickness

8OZ(Outer)

Thermal conductivity

Standard materials: 1-3W/m.k,

Specified materials : 4-12W/m.k

Ceramic materials: 24-170W/m.k

Other

Max copper thickness

8OZ(Outer) 7OZ(Inter)

Layer Count

1-24

Board thickness

0.4mm~5.0mm

Board thickness TOL

±10%(>1.0mm); ±0.1mm(≤1.0mm)

Min board dimensions

10*10mm

Max board dimensions

20*30inch(2Layer), 22.5*30inch(4Layer), 16.5*22.5inch(≥6Layer)

Twisting and bending

≤0.75%  Min0.5%

Impedance Tolerance

±5Ω(<50Ω), ±10%(≥50Ω)


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