Half hole PCB
8Layer,5mil/5mil, ENIG + OSP, Half holes Base MaterialFr4 TG170 Board Thickness1.2 mm Copper
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Half hole PCB
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Product Description
8Layer,5mil/5mil, ENIG + OSP, Half holes
Base Material | Fr4 TG170 |
Board Thickness | 1.2 mm |
Copper Thickness | 1OZ |
Min. Hole Size | 8mil (0.2mm) |
Min. Line Width/ Spacing | 5mil (0.125mm)/5mil (0.125mm) |
Solder mask Color | Green |
Silkscreen Color | White |
Surface Finishing | ENIG + OSP |
Min.Quantity of Order | No MOQ |
Certificate | UL, ISO 9001, ISO 14001 |
Difficulty | 5mil/5mil, ENIG + OSP, Half holes |
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