SMT Step Stencils
Stencil thickness should meet the minimum spacing QFP, BGA , taking into account the smallest chip components.
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SMT Step Stencils
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Product Description
Stencil thickness should meet the minimum spacing QFP, BGA , taking into account the smallest chip components.
QFP pitch≤0.5MM , stencil thickness 0.12mm; QFP pitch>0.5MM, stencil thickness 0.15mm-0.18mm ; BGA pitch>1.0mm , stencil thickness 0.15mm , 0.5mm≤BGA pitch≤1.0mm, tencil shim thickness 0.12mm . (Refer to .....)
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